Under the global trends where electronic products are getting thinner, multi-functional and low power, the SiP (System in Package) technology has grabbed increasing attention, especially in recent years where the demand for lightweight mobile devices and wearables rises. With the IoT (Internet of Things) era approaching, multi-functional integration and low power consumption are considered essential when selecting an electronic product.
Hence, SiP is playing an increasingly important role in the development of packaging technology. This report provides an in-depth analysis of global SiP development from three dimensions: technology development, market application development, and industry trends; examines how SiP shapes up and influences the semiconductor industry, particularly packaging and testing service providers, IC substrate manufacturers, and foundries.
List of Topics
Development of SiP from the industry perspective and includes favorable and detrimental factors
Development of SiP from the perspective of market applications, touching on smartphones, other mobile devices, wearables and IoT
Development of SiP from the perspective of packaging and testing service providers, IC substrate manufacturers and foundries
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List of compaines
Nan Ya PCB
Table of Contents 1.Global Development of SIP Technology1.1 High Levels of Integration and Miniaturization Drive SiP Development1.2 SiP/Module Design Bundles for Diverse Development1.3 Entry Barriers to SiP Remain High 2.Development of Global SiP Market Applications2.1 Smartphones as Key Growth Driver for SiP2.2 Mobile Devices, Wearables, and IoT Continue to Spur Demand for SiP 3.Development of the Global SiP industry3.1 Packaging and Testing Service Providers Make Aggressive Move Towards SiP3.2 IC Substrate Makers Also Extend Reach to SiP3.3 Foundries Aim for Turnkey Services with SiP 4. Conclusion4.1 Complete Supply Chain as Cornerstone of SiP DevelopmentAppendixGlossary of TermsList of Companies List of FiguresFigure 1: How SiP Boosts Levels of Integration and MiniaturizationFigure 2: Major SiP Packaging TechnologiesFigure 3: Use of SiP Modules in SmartphonesFigure 4: Global SiP Shipment Value and Growth, 2013-2016Figure 5: Cooperation and Competition Between Foundries and Packaging and Testing Service Providers”
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